@article {18595,
	title = {3DCAM: A Low Overhead Crosstalk Avoidance Mechanism for TSV-Based 3D ICs},
	journal = {arXiv preprint arXiv:1901.00568, Initially accepted in International Conference on Computer Design (ICCD{\textquoteright}15)},
	year = {2019},
	author = {Mirosanlou, Reza and Taram, Mohammadkazem and Shirmohammadi, Zahra and Miremadi, Seyed-Ghassem}
}
