Wire Bonding Equipment

Specifications

• Ultrasonic frequency: 130 kHz
• Flying bondhead
• Fixed electrode (EFO currents upto 400 mA)
• Bond placement accuracy: ± 2.5 µm (3 sigma)
• Sprint UPH: 17 wires/second (UPH depends on material/ process requirements)
• Maximum bonding area: 52 mm x 70 mm (2" x 2.7")
• Process zone temperature: ambient to 300°C
• Various looping profiles, maximum loop length of 9 mm

Application

• Gold and copper wire (17.5 µm–50µm diameter) ball-wedge bonding

Specifications

• Ultrasonic frequency: 130 kHz
• Cu-kit with movable electrode
• Sprint UPH: 10 wires/second (UPH depends on material/process requirements)
• Maximum bonding area: 52 mm x 70 mm (2" x 2.7")
• Process zone temperature: ambient to 300°C
• Various looping profiles

Application

• Gold wire (17.5µm – 50µm diameter) and copper wire (17.5µm – 25µm diameter) ball-wedge bonding

K&S 4524 Digital Ball-Wedge Bonder

Application

• Gold wire (25µm - 50µm diameter) ball-wedge bonding

K&S 4523A Digital Wedge-Wedge Bonder

Application

• Aluminum and gold (25µm - 50µm diameter) wedge-wedge bonding