Automatic Wire Bonders

ESEC 3100 Ball-Wedge Bonder

Specifications

  • Ultrasonic frequency: 130 kHz
  • Flying bondhead
  • Fixed electrode (EFO currents upto 400 mA)
  • Bond placement accuracy: ± 2.5 µm (3 sigma)
  • Sprint UPH: 17 wires/second (UPH depends on material/ process requirements)
  • Maximum bonding area: 52 mm x 70 mm (2" x 2.7")
  • Process zone temperature: ambient to 300°C
  • Various looping profiles, maximum loop length of 9 mm

Application

  • Gold and copper wire (17.5 µm–50µm diameter) ball-wedge bonding

A ESEC 3100 ball-wedge bonder

 

ESEC 3088 Ball-Wedge Bonder

Specifications

  • Ultrasonic frequency: 130 kHz
  • Cu-kit with movable electrode
  • Sprint UPH: 10 wires/second (UPH depends on material/process requirements)
  • Maximum bonding area: 52 mm x 70 mm (2" x 2.7")
  • Process zone temperature: ambient to 300°C
  • Various looping profiles

Application

  • Gold wire (17.5µm – 50µm diameter) and copper wire (17.5µm – 25µm diameter) ball-wedge bonding

A ESEC 3088 bal-wedge bonder

 

Manual Wire Bonders

K&S 4524 Digital Ball-Wedge Bonder

Application

  • Gold wire (25µm - 50µm diameter) ball-wedge bonding

K&S 4523A Digital Wedge-Wedge Bonder

Application

  • Aluminum and gold (25µm - 50µm diameter) wedge-wedge bonding

A K and S digital ball-wedge bonderA K and S 4523A digital wedge-wedge bonder