Automatic Wire Bonders
ESEC 3100 Ball-Wedge Bonder
Specifications
- Ultrasonic frequency: 130 kHz
- Flying bondhead
- Fixed electrode (EFO currents upto 400 mA)
- Bond placement accuracy: ± 2.5 µm (3 sigma)
- Sprint UPH: 17 wires/second (UPH depends on material/ process requirements)
- Maximum bonding area: 52 mm x 70 mm (2" x 2.7")
- Process zone temperature: ambient to 300°C
- Various looping profiles, maximum loop length of 9 mm
Application
- Gold and copper wire (17.5 µm–50µm diameter) ball-wedge bonding
ESEC 3088 Ball-Wedge Bonder
Specifications
- Ultrasonic frequency: 130 kHz
- Cu-kit with movable electrode
- Sprint UPH: 10 wires/second (UPH depends on material/process requirements)
- Maximum bonding area: 52 mm x 70 mm (2" x 2.7")
- Process zone temperature: ambient to 300°C
- Various looping profiles
Application
- Gold wire (17.5µm – 50µm diameter) and copper wire (17.5µm – 25µm diameter) ball-wedge bonding
Manual Wire Bonders
K&S 4524 Digital Ball-Wedge Bonder
Application
- Gold wire (25µm - 50µm diameter) ball-wedge bonding
K&S 4523A Digital Wedge-Wedge Bonder
Application
- Aluminum and gold (25µm - 50µm diameter) wedge-wedge bonding