PhD student

Affiliations

Dr. Aashish S Shah Centre for Advanced Materials Joining
Department of Mechanical and Mechatronics Engineering
University of Waterloo

Contact Information

Phone: (519)-888-4567 ext. 33326
Fax: (519)-0888-5862
Office: E3-3110A
Email: ashah011@uwaterloo.ca

Department of Mechanical and Mechatronics Engineering
University of Waterloo
200 University Avenue West
Waterloo, Ontario N2L 3G1
Canada

Biographical Information

2010: Doctor of Philosophy (PhD), Mechanical Engineering Department of Mechanical and Mechatronics Engineering, University of Waterloo, Canada.

2005: MASc, Mechanical Engineering, University of Ottawa, Canada.

2002: BASc, Mechanical Engineering, Jawaharlal Nehru Technological University, India.

Research Interests

  • Wire bonding for microelectronics: process mechanisms, optimization, and reliability
  • CMOS microsensors for wire bond process studies
  • Finite element modeling

Selected Publications

  • Qin, I., Shah, A., Cuong, H., Meyer, M., Mayer, M., and Zhou, Y., “Effect of Process Parameters on Pad Stress during Au and Cu Ball Bonding Processes”, Proceedings of IEEE Electronics Packaging and Technology Conference, Singapore, Dec 9-12, 2009. pp. 573-578.
  • Huang, Y., Shah, A., Mayer, M., Zhou, Y., and Persic, J., “Effect of Ultrasonic Capillary Dynamics on the Mechanics of Thermosonic Ball Bonding”, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control. 57(1): 241-252, 2010
  • Shah, A., Mayer, M., Zhou, Y., and Hong, S. J., “In-situ Ultrasonic Force Signals during Low Temperature Thermosonic Copper Wire Bonding using Piezo-resistive Microsensors”, Microelectronics Engineering. 85(9) 1851-1857.
  • Shah, A., Mayer, M., Zhou, Y., Hong, S. J., and Moon, J. T., “Low-stress Thermosonic Copper Ball Bonding”, IEEE Transactions on Electronics Packaging Manufacturing. 32(3): 1-9, 2009
  • Shah, A., Lee, J., Mayer, M., and Zhou, Y., “Online Methods to Measure the Breaking Strength of Fine Bonding Wire using a CMOS Stress Sensor and a Proximity Sensor”, Sensors and Actuators A: Physical. [In Press]
  • Shah, A., Mayer, M., Zhou, Y., Persic, J., and Moon, C. T., “Optimization of Ultrasound and Bond Force to Reduce Pad Stress during Thermosonic Copper Ball Bonding”, Proceedings of IEEE Electronics Packaging and Technology Conference, Singapore, Dec 9-12, 2009. pp. 10-15.
  • Shah, A., Mayer, M., Zhou, Y., Persic, J., and Moon, C. T., “Reduction of Ultrasonic Pad Stress and Aluminium Splash in Copper Ball Bonding”, Microelectronics Reliability Special Issue on Copper Wire Bonding. In Press, 2010
  • Shah, A., Mayer, M., Zhou, Y., Hong, S. J., Moon, C. T., “Reduction of Underpad Stress in Thermosonic Copper Ball Bonding”, Proceedings of IEEE 58th Electronic Components and Technology Conference, Lake Buena Vista, Florida, U.S.A, May 27-30, 2008.
  • Qin, I., Shah, A., Cuong, H., Meyer, M., Mayer, M., and Zhou, Y., “Role of Process Parameters on Bondability and Pad Damage Indicators in Copper Ball Bonding”, Microelectronics Reliability Special Issue on Copper Wire Bonding. In Press, 2010
  • Gaul, H., Shah, A., Mayer, M., Zhou, Y., Schneider-Ramelow, M., and Reichl, H., “The Ultrasonic Wedge/Wedge Bonding Process Investigated using In situ Real-Time Amplitudes from Laser Vibrometer and Integrated Force Sensor”, Microelectronics Engineering. 87(4): 537-542, 2010
  • Qin, I., Shah, A., Cuong, H., Meyer, M., Mayer, M., and Zhou, Y., “Thermosonic Au Ball Bonding Process Investigated using Microsensor and Laser Vibrometer”, Proceedings of IEEE Electronics Components and Technology Conference, Las Vegas, Nevada, U.S.A., Jun 1-6, 2010. Dec 9-12, 2009. In press (accepted manuscript).
  • Shah, A., Gaul, H., Mayer, M., Zhou, Y., Schneider-Ramelow, M., and Reichl, H., “Ultrasonic Friction Power during Al Wire Wedge-Wedge Bonding”, of Applied Physics. 106(1): 013503, 2009
Affiliation: 
University of Waterloo