- A. Gerlich; P. Su; T. H. North, Tool penetration during friction stir spot welding of Al and Mg alloys (PDF), Journal of Materials Science, 40 (24), 2005, pg. 6473-6481
- A.H. Noroozi; G. Glinka; S. Lambert, A two parameter driving force for fatigue crack growth analysis (PDF), International Journal of Fatigue, 27 (10-12), 2005, pg. 1277-1296
- K. Sadananda; G. Glinka, Dislocation processes that affect kineticsof fatigue crack growth (PDF), Philosophical Magazine, 85 (2-3), 2005, pg. 189-203
- Nguyen, T.C., Weckman, D.C., Johnson, D.A., Kerr, H.W., (2005), The Humping Phenomenon during High Speed Gas Metal Arc Welding (PDF), Sci. Technol. Welding Joining, Vol. 10, No. 4, pp. 447- 459.
- X. Li, J. Xie, Y. Zhou, Effects of Oxygen Contamination in the Argon Shielding Gas in Laser Welding of Commercially Pure Titanium Thin Sheet (PDF), J. Mater. Sci., 40, 2005, 3437-43
- Y. Zhou, X. Li and N. Noolu, A Footprint Study of Bond Initiation in Gold Wire Crescent Bonding (PDF), IEEE Trans. Comps. Packg. Technol., 28 (4), 2005, 810-816
- J. Lee, J.P. Jung, C.S. Cheon, Y. Zhou and M. Mayer, Flip Chip Bump Formation of Sn–1.8Bi–0.8Cu–0.6In Solder by Stencil Printing (PDF), Mater. Trans., 46(11), 2005, 2359-65
- S. Fukumoto, Z. Chen and Y. Zhou, Interfacial Phenomena and Joint Strength in Resistance Microwelding of Crossed Au-plated Ni Wires (PDF), Metall. Mater. Trans. A, 36A, 2005, 2717-24
- M.L. Kuntz, S.F. Corbin, Y. Zhou, Quantifying Metallurgical Interactions in Solid/Liquid Diffusion Couples Using Differential Scanning Calorimetry (PDF), Acta Materialia, 53, 2005, 3071-82
- W. Tan, S. Lawson, Y. Zhou, Effects of Au Plating on Dynamic Resistance during Small-Scale Resistance Spot Welding of Thin Ni Sheets (PDF), Metall. Mater. Trans. A, 36A (7), 2005, 1901-1910
- J.K. Moon, Y. Zhou, J.P. Jung, Fluxless Plasma Bumping of Lead-free Solders and the Reliability Effects of Under Bump Metallization Thickness (PDF), Soldering Surface Mount Technol., 17(2), 2005, 3–9 (Highly Commended Award 2006 by Emerald Literati Network)
- N.J. Noolu, H.W. Kerr, Y. Zhou and J. Xie, Laser Weldability of Pt and Ti Alloys (PDF), Mater. Sci. Eng. A, 397, 2005, 8–15
- I. Lum, J.P. Jung, and Y. Zhou, Bonding Mechanism in Ultrasonic Gold Ball Bonds on Copper Substrate (PDF), Metall. Mater. Trans. A, 36A, 2005, 1279-86
- B.H. Chang, Y. Zhou, I. Lum and D. Du, Finite Element Analysis on the Effect of Electrode Pitting in Resistance Spot Welding of an Aluminium Alloy (PDF), Sci. Technol. Weld. Join., 10(1), 2005, 61-66
