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Centre for Advanced Materials Joining
  • Centre for Advanced Materials Joining home
  • About Centre for Advanced Materials Joining
  • Research Areas
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    • Analytical Equipment
    • Equipment for Specimen Preparation
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  1. Centre for Advanced Materials Joining
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  3. Publications

2005 Publications

  • A. Gerlich; P. Su; T. H. North, Tool penetration during friction stir spot welding of Al and Mg alloys (PDF), Journal of Materials Science, 40 (24), 2005, pg. 6473-6481
  • A.H. Noroozi; G. Glinka; S. Lambert, A two parameter driving force for fatigue crack growth analysis (PDF), International Journal of Fatigue, 27 (10-12), 2005, pg. 1277-1296
  • K. Sadananda; G. Glinka, Dislocation processes that affect kineticsof fatigue crack growth (PDF), Philosophical Magazine, 85 (2-3), 2005, pg. 189-203
  • Nguyen, T.C., Weckman, D.C., Johnson, D.A., Kerr, H.W., (2005), The Humping Phenomenon during High Speed Gas Metal Arc Welding (PDF), Sci. Technol. Welding Joining, Vol. 10, No. 4, pp. 447- 459.
  • X. Li, J. Xie, Y. Zhou, Effects of Oxygen Contamination in the Argon Shielding Gas in Laser Welding of Commercially Pure Titanium Thin Sheet (PDF), J. Mater. Sci., 40, 2005, 3437-43
  • Y. Zhou, X. Li and N. Noolu, A Footprint Study of Bond Initiation in Gold Wire Crescent Bonding (PDF), IEEE Trans. Comps. Packg. Technol., 28 (4), 2005, 810-816
  • J. Lee, J.P. Jung, C.S. Cheon, Y. Zhou and M. Mayer,  Flip Chip Bump Formation of Sn–1.8Bi–0.8Cu–0.6In Solder by Stencil Printing (PDF), Mater. Trans., 46(11), 2005, 2359-65
  • S. Fukumoto, Z. Chen and Y. Zhou, Interfacial Phenomena and Joint Strength in Resistance Microwelding of Crossed Au-plated Ni Wires (PDF), Metall. Mater. Trans. A, 36A, 2005,  2717-24
  • M.L. Kuntz, S.F. Corbin, Y. Zhou, Quantifying Metallurgical Interactions in Solid/Liquid Diffusion Couples Using Differential Scanning Calorimetry (PDF), Acta Materialia, 53, 2005, 3071-82
  • W. Tan, S. Lawson, Y. Zhou, Effects of Au Plating on Dynamic Resistance during Small-Scale Resistance Spot Welding of Thin Ni Sheets (PDF), Metall. Mater. Trans. A, 36A (7), 2005, 1901-1910
  • J.K. Moon, Y. Zhou, J.P. Jung, Fluxless Plasma Bumping of Lead-free Solders and the Reliability Effects of Under Bump Metallization Thickness (PDF), Soldering Surface Mount Technol., 17(2), 2005, 3–9 (Highly Commended Award 2006 by Emerald Literati Network)
  • N.J. Noolu, H.W. Kerr, Y. Zhou and J. Xie, Laser Weldability of Pt and Ti Alloys (PDF), Mater. Sci. Eng. A, 397, 2005, 8–15
  • I. Lum, J.P. Jung, and Y. Zhou, Bonding Mechanism in Ultrasonic Gold Ball Bonds on Copper Substrate (PDF), Metall. Mater. Trans. A, 36A, 2005, 1279-86
  • B.H. Chang, Y. Zhou, I. Lum and D. Du, Finite Element Analysis on the Effect of Electrode Pitting in Resistance Spot Welding of an Aluminium Alloy (PDF), Sci. Technol. Weld. Join., 10(1), 2005, 61-66
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The University of Waterloo acknowledges that much of our work takes place on the traditional territory of the Neutral, Anishinaabeg and Haudenosaunee peoples. Our main campus is situated on the Haldimand Tract, the land granted to the Six Nations that includes six miles on each side of the Grand River. Our active work toward reconciliation takes place across our campuses through research, learning, teaching, and community building, and is centralized within our Indigenous Initiatives Office.

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