Ting Tsui

Associate Professor, Chemical Engineering

Contact Information

Phone: 519-888-4567 x38404
Location: C2 079

Education

  • PhD, Rice University
  • MSc, Rice University
  • BSc, Clemson University

Research Interests

  • Nanoindentation
  • Sub-micron fabrication
  • Nanomechanics
  • Thin Film Delaminations
  • Small scale mechanical properties in extreme environments

Teaching

  • NE 318
  • CHE 241
  • CHE 750

Selected/Recent Publications

  • Soheil Barakat, Pearl Lee-Sullivan, Steven A. Vitale, and Ting Y. Tsui, “The effects of low-temperature and pressure on the fracture behaviors of organosilicate thin films”, Journal of Materials Research, In Press, August 2011.
  • Gyuhyon Lee, Ju-Young Kim, Michael J. Burek, Julia R. Greer, Ting Y. Tsui, “Mechanical Properties of Indium Nanostructures”, Materials Science and Engineering A 528 (2011) 6112–6120
  • Michael J. Burek, Sumin Jin, Michael C. Leung, Zeinab Jahed, Janet Wu, Arief Suriadi Budiman, Nobumichi Tamura, Martin Kunz, Ting Y. Tsui, “Grain boundary effects on the mechanical properties of bismuth nanostructure”, Acta Materialia 59 (2011) 4709–4718 (2011)
  • Michael J. Burek, Arief Suriadi Budiman, Zeinab Jahed, Nobumichi Tamura, Martin Kunz, Sumin Jin, Seung Min J. Han, Gyuhyon Lee, Colin Zamecnik, Ting Y. Tsui, “Fabrication, microstructure, and mechanical properties of tin, nanostructures”, Materials Science and Engineering A 528 (2011) 5822–5832
  • Scott Smith, Ting Y. Tsui, and Paul H. Ho, “Analysis of Ultra-Violet Curing Effect on the Dielectric Constant and Molecular Structure of a Porous Dielectric Film”, Journal of Electronic Materials, (May 2010)