Congratulations to Mr. Daniel Dapaah for his paper accepted to the 1st annual BioMM conference

Friday, April 20, 2018

Congratulations to Mr. Daniel Dapaah, MASc candidate in the WCBSL, for his recent paper (A CONTINUUM DAMAGE MECHANICS MODEL OF THE MICRODAMAGE PROCESS ZONE DURING CORTICAL BONE FRACTURE) accepted to The 1st International Conference on Materials, Mimicking, Manufacturing from and for Bio Application (www.biomm.org; Milan, Italy, June 2018).