Michael Mayer

Associate Professor, Mechanical and Mechatronics Engineering
Contact Information
Groups
Lightweighting and Fabrication, Joining, I to M profiles
Links
Link to profile: Michael Mayer
Additional Information

Research Expertise

  • Electronic packaging
  • Microfabrication
  • Microjoining processes
  • Sensor technology
  • Thermosonic and ultrasonic wire bonding
  • Ultrasonic Finite Element Models

Centre for Advanced Materials Joining