Associate Professor, P.Eng.

Contact InformationMichael Mayer

Phone: 519-888-4024
Location: E5 3009

Website

Biography Summary

The research is focused on electronics packaging and joining processes. My group develops custom in-situ sensing methods, setups, and CMOS sensors. One research interest is wire bonding in microelectronics and the physical mechanisms responsible for reliable thermosonic ball and ultrasonic wedge bonding processes. The work covers experimental, analytical, and numerical investigations. We work with new materials, methods, and theories. Other areas of research include microelectronic soldering and fabric metallization.

Research Interests

  • Electronic Packaging
  • Microjoining
  • Wire Bonding in Microelectronics
  • Ultrasonic Welding
  • Process Monitoring
  • Reliability
  • Sensors and Devices
  • Connectivity and Internet of Things
  • IoT
  • Devices

Education

  • 2000, Doctorate, Technical Sciences, Swiss Federal Institute of Technology Zurich (ETH)
  • 1994, Master's, Physics, Swiss Federal Institute of Technology Zurich (ETH)

Courses*

  • ME 115 - Structure and Properties of Materials
    • Taught in 2014
  • ME 596 - Special Topics in Mechanical Engineering
    • Taught in 2014, 2015, 2016, 2017, 2018, 2019
  • ME 735 - Special Topics - Welding and Joining
    • Taught in 2014, 2015, 2016, 2017
  • MTE 111 - Structure and Properties of Materials
    • Taught in 2014, 2015, 2016, 2017, 2018, 2019
* Only courses taught in the past 5 years are displayed.

Selected/Recent Publications

  • Campbell, Eric E and He, Ruijian and Mayer, Michael, Conductive pathway on cotton fabric created using solution with silver organometallic compound, Materials Research Express, 2017
    Link
  • Xu, Di Erick and Kim, Jang Baeg and Hook, Michael David and Jung, Jae Pil and Mayer, Michael, Real time resistance monitoring during sintering of silver paste, Journal of Alloys and Compounds, 2017
    Link
  • Laor, Ari and Athia, Depayne and Rezvani, Alireza and Clauberg, Horst and Mayer, Michael, Monitoring of thermo-mechanical stress via CMOS sensor array: Effects of warpage and tilt in flip chip thermo-compression bonding, Microelectronics Reliability, 73, 2017, 60 - 68
  • Xu, Di Erick and Hook, Michael David and Mayer, Michael, Real time joint resistance monitoring during solder reflow, Journal of Alloys and Compounds, 695, 2017, 3002 - 3010
    Link
  • Hook, Michael David and Mayer, Michael, Miniature environmental chambers for temperature humidity bias testing of microelectronics, Review of Scientific Instruments, 88, 2017
  • Laor, A. and Herrell, P.J. and Mayer, M., A Study on Measuring Contact Resistance of Ball Bonds on Thin Metallization, Components, Packaging and Manufacturing Technology, IEEE Transactions on, 5(5), 2015, 704 - 708
    Link
  • Athia, Depayne and Rezvani, Alireza and Clauberg, Horst and Qin, Ivy and Mayer, Michael, Numerical Simulations of Joint-to-Joint Temperature Variation During Thermo-Compression Bonding, Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th, 05 2017, Orlando, 1906 - 1915
    Link
  • Mayer, M., Gomes, J., Accelerating Reliability Assessment with Multi-Oven Racks and Sensor Chips for Wire Bonds, IMAPS New England 42nd Symposium, 05 2015, Boxborough, MA. (Accepted in 2015)
    Link