Michael Mayer

The research is focused on electronics packaging and joining processes. My group develops custom in-situ sensing methods, setups, and CMOS sensors. One research interest is wire bonding in microelectronics and the physical mechanisms responsible for reliable thermosonic ball and ultrasonic wedge bonding processes. The work covers experimental, analytical, and numerical investigations. We work with new materials, methods, and theories. Other areas of research include microelectronic soldering and fabric metallization.

• Electronic Packaging
• Microjoining
• Wire Bonding in Microelectronics
• Ultrasonic Welding
• Process Monitoring
• Reliability
• Sensors and Devices
• Connectivity and Internet of Things
• IoT
• Devices

• 2000, Doctorate, Technical Sciences, Swiss Federal Institute of Technology Zurich (ETH)
• 1994, Master's, Physics, Swiss Federal Institute of Technology Zurich (ETH)

• ME 115 - Structure and Properties of Materials
  • Taught in 2014
• ME 596 - Special Topics in Mechanical Engineering
  • Taught in 2014, 2015, 2016, 2017, 2018, 2019
• ME 735 - Special Topics - Welding and Joining
  • Taught in 2014, 2015, 2016, 2017
• MTE 111 - Structure and Properties of Materials
  • Taught in 2014, 2015, 2016, 2017, 2018, 2019

• Campbell, Eric E and He, Ruijian and Mayer, Michael, Conductive pathway on cotton fabric created using solution with silver organometallic compound, Materials Research Express, 2017
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• Xu, Di Erick and Kim, Jang Baeg and Hook, Michael David and Jung, Jae Pil and Mayer, Michael, Real time resistance monitoring during sintering of silver paste, Journal of Alloys and Compounds, 2017
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• Laor, Ari and Athia, Depayne and Rezvani, Alireza and Clauberg, Horst and Mayer, Michael, Monitoring of thermo-mechanical stress via CMOS sensor array: Effects of warpage and tilt in flip chip thermo-compression bonding, Microelectronics Reliability, 73, 2017, 60 - 68
• Xu, Di Erick and Hook, Michael David and Mayer, Michael, Real time joint resistance monitoring during solder reflow, Journal of Alloys and Compounds, 695, 2017, 3002 - 3010
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• Hook, Michael David and Mayer, Michael, Miniature environmental chambers for temperature humidity bias testing of microelectronics, Review of Scientific Instruments, 88, 2017
• Laor, A. and Herrell, P.J. and Mayer, M., A Study on Measuring Contact Resistance of Ball Bonds on Thin Metallization, Components, Packaging and Manufacturing Technology, IEEE Transactions on, 5(5), 2015, 704 - 708
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• Athia, Depayne and Rezvani, Alireza and Clauberg, Horst and Qin, Ivy and Mayer, Michael, Numerical Simulations of Joint-to-Joint Temperature Variation During Thermo-Compression Bonding, Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th, 05 2017, Orlando, 1906 - 1915
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• Mayer, M., Gomes, J., Accelerating Reliability Assessment with Multi-Oven Racks and Sensor Chips for Wire Bonds, IMAPS New England 42nd Symposium, 05 2015, Boxborough, MA. (Accepted in 2015)
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