Dalsgaard, T.-S. ., & Schneider, O. . (2025). A Unified Model for Haptic Experience. ACM Transactions on Computer-Human Interaction. https://doi.org/10.1145/3711842
Publications
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Rizvi, A. ., Schneider, O. ., & Hancock, M. . (2024). Proteus Card Deck: Enabling Remote Play with A Physical Card Deck. CHI PLAY Companion ’24, 331–335. New York, NY, USA: Association for Computing Machinery. https://doi.org/10.1145/3665463.3678842 (Original work published 2024)
Joshi, B. ., Kollannur, S. ., Mishra, A. ., Nguyen, T. ., & Schneider, O. . (2024). Haptic Playground: Empowering Inclusive Haptic Design for Everyone. CHI Extended Abstracts (Workshops). Presented at the. New York, NY, USA: Association for Computing Machinery. https://doi.org/10.1145/3613905.3636303 (Original work published 2024)
Wall, L. W., Schneider, O. ., & Vogel, D. . (2024). Scrappy and Substiports: User-Inserted Ad Hoc Objects For Faster, More Sustainable 3D Printing. CHI Extended Abstracts (Demo). Presented at the. New York, NY, USA: Association for Computing Machinery. https://doi.org/10.1145/3613905.3648676 (Original work published 2024)
Wall, L. W. (2023). Substiports: User-Inserted Ad Hoc Objects as Reusable Structural Support for Unmodified FDM 3D Printers. UIST’23. Presented at the. New York, NY, USA: Association for Computing Machinery. https://doi.org/10.1145/3586183.3606718 (Original work published 2023)
Theivendran, K. ., Wu, A. ., Frier, W. ., & Schneider, O. . (2023). RecHap: An Interactive Recommender System for Navigating a Large Number of Mid-Air Haptic Designs. IEEE Transactions on Haptics, 17, 12. https://doi.org/10.1109/TOH.2023.3276812 (Original work published 2023)
Dahiya, A. ., Cai, Y. ., Schneider, O. ., & Smith, S. . (2023). On the Impact of Interruptions During Multi-Robot Supervision Tasks. IEEE ICRA, 9771-9777. https://doi.org/10.1109/ICRA48891.2023.10160323 (Original work published 2023)
Singhal, T. ., & Schneider, O. . (2021). Juicy Haptic Design: Vibrotactile Embellishments Can Improve Player Experience in Games. CHI ’21: Proceedings of the 2021 CHI Conference on Human Factors in Computing Systems. Presented at the. https://doi.org/https://doi.org/10.1145/3411764.3445463 (Original work published 2021)
Sathiyamurthy, S. N., Lui, M. ., Kim, E. ., & Schneider, O. . (2021). Measuring Haptic Experience: Elaborating the HX Model with Scale Development. N/A. Presented at the. IEEE. Retrieved from https://dl.acm.org/doi/10.1145/3486954 (Original work published 2021)
Wall, L. W., Jacobson, A. ., Vogel, D. ., & Schneider, O. . (2021). Scrappy: Using Scrap Material as Infill to Make Fabrication More Sustainable. CHI ’21: Proceedings of the 2021 CHI Conference on Human Factors in Computing Systems. Presented at the. https://doi.org/https://doi.org/10.1145/3411764.3445187 (Original work published 2021)