Citation:
Mirosanlou, R. , Taram, M. , Shirmohammadi, Z. , & Miremadi, S. - G. . (2019). 3DCAM: A Low Overhead Crosstalk Avoidance Mechanism for TSV-Based 3D ICs. arXiv preprint arXiv:1901.00568, Initially accepted in International Conference on Computer Design (ICCD'15).
