Friday, May 23, 2025
We were thrilled to host Prof. Jae Pil Jung from the University of Seoul this week! He shared his extensive expertise on "Recent Progress of Low-Temperature Soldering for Electronics Packaging," leading to an excellent and highly productive discussion. Prof. Jung has partnered with industry leaders like Samsung, LG, and more, in advancing cutting-edge technology in low-temperature soldering and electronics packaging. We especially appreciate his decades-long collaboration with CAMJ, and thank him for returning to give such an insightful presentation.
A special thanks to Prof. Y. Norman Zhou for organizing this insightful event.