Accuton-50 Wafer Cutting Machine
Specifications
![A Accuton-50 wafer cutting machine](/centre-advanced-materials-joining/sites/default/files/uploads/images/picture027_0.jpg)
- Accuracy of x, y displacement: 1um
- Minimum feeding speed: 1um/s
Model 1010 Low Angle Ion Milling and Polishing System
Specifications
![A Model 1010 low angle ion milling and polishing system](/centre-advanced-materials-joining/sites/default/files/uploads/images/picture028_0.jpg)
- Range of extractor voltage: 0.5-6.0 kV
- Current: 3-8 mA
- Maximum ion beam current: 400 μA
- Beam angle range: 0-30°
- Vacuum environment
- Argon gas
Ecomet 3 Variable Speed Grinder-Polisher
Specifications
![A Ecomet 3 variable speed grinder-polisher](/centre-advanced-materials-joining/sites/default/files/uploads/images/ecomet_0.jpg)
- Pressing force
- Rotating direction and speed