Wire Bonding Equipment

Specifications

• Ultrasonic frequency: 130 kHz
• Fixed electrode (EFO currents upto 400 mA)
• Bond placement accuracy: 2.5 m (3 sigma)
• Fast bonding up to 17 wires/second
• Maximum bonding area: 52 mm x 70 mm
• Process zone temperature: ambient to 300C
• Various looping profiles, maximum loop length of 9 mm

Application

• Gold and copper wire (17.5 micron to 50 micron diameter) ball-wedge bonding

Specifications

• Ultrasonic frequency: 130 kHz
• Cu-kit with movable electrode
• Process zone temperature: ambient to 300C
• Various looping profiles

Application

• Gold wire (17.5 micron to 50 micron diameter) and copper wire (17.5 micron to 25 micron diameter) ball-wedge bonding

KS 4524 Digital Ball-Wedge Bonder

Application

• Gold wire (25m - 50m diameter) ball-wedge bonding

KS 4523A Digital Wedge-Wedge Bonder

Application

• Aluminum and gold (25m - 50m diameter) wedge-wedge bonding