January 7 |
Centre for Advanced Materials Joining yearly update 2009 |
Professor Zho |
January 7 |
Heat sink effect of a gold wire bond next to hot spots on a microchip |
Michael McCracken |
January 14 |
Mechanical Property and microstructures of two resistance spot welded AZ31 magnesium alloys |
Liu Ray |
January 21 |
Weldability of nitinol crossed wires |
Billy Tam |
January 28 |
Study of Au ball bonding on Pd-Ni-Cu substrate |
Yan Huang |
February 4 |
Nd:YAG laser microwelding of nitinol |
Ibraheem Khan |
February 11 |
Electromagnetic impact welding of Mg to Al sheets |
Sachin Kore |
February 18 |
Effect of brazing temperature on tensile performance of CNT/alloy bond |
Wei Wu |
February 25 |
Nano-scale properties and TEM characterization of resistance spot welded dual phase steel |
Victor Baltazar |
March 4 |
Online FAB characterization method: effects of gas type and flow rate on Cu FAB formation in thermosonic wire bonding |
Andrew Pequegnat |
March 11 |
Effect of weld location, orientation and strain path on formability of DP600-HSLA tailored blank for automotive applications |
Sushanta Panda |
March 18 |
Weldability study of AZ31 via laser processes |
Elliot Powidajko |
March 25 |
Microstructure study in Cu wire bonding |
Hua Huang |
April 1 |
Electro-spark deposition of TiC/Ni on Cu substrate |
Siu Kei Tang |
April 8 |
Gas metal arc welding of dual phase steel |
Trevor Burns |
April 15 |
Evaluation of halogen-free laminates for handheld application |
David Lau |
April 22 |
Ultrasonic friction power during Al wire wedge/wedge bonding |
Aashish Shah |