Senior Packaging Engineer

Contact Information

Email: narendra.j.noolu@intel.com
Intel Corporation
5000 W. Chandler Boulevard
Chandler, AZ 85226
USA

Biographical Information

Since 2005: Senior Packaging Engineer, Intel Corporation, Chandler, AZ, USA
2002 to 2004: Postdoctoral fellow, Centre for Advanced Materials Joining, University of Waterloo
1997 to 2001: PhD degree, The Ohio State University, Columbus, OH, USA
1993 to 1995: MSc degree, Indian Institute of Technology, Madras, India
1989 to 1993: BSc degree in Metallurgical Engineering, Andhra University, Andhra, India

Selected Publications

  • Y. Zhou, X. Li, N. Noolu, “A Footprint Study of Bond Initiation in Gold Wire Crescent Bonding”, Transactions on Components and Packaging Technologies, vol. 28, no. 4, December, 2005, p. 810-816
  • N. Noolu, I. Lum, Y. Zhou, “Roughness Enhanced Au Ball Bonding of Cu Substrates”, IEEE Transactions on Components and Packaging Technologies, vol. 29, no. 3, September, 2006, p. 457-463
Affiliation: 
University of Waterloo