Former member
Affiliations
Microjoining Laboratory
School of Material Science and Engineering
Harbin Institute of Technology
Harbin, China, 150001
Contact Information
Phone: (6-4) -86–183
Email: hangcg@hit.edu.cn
Biographical Information
2006: Assistant Researcher, Harbin Institute of Technology, People's Republic of China, Specialization in Copper Wire Bonding.
2003: MASc, Harbin Institute of Technology, People's Republic of China, Specialization in Electrical Machining of Insulating Ceramic.
2001: BASc, Harbin Institute of Technology, People's Republic of China, Specialization in Electrical Machining.
Research Projects
Copper wire bonding mechanism
- To improve the wire bonding reliability, study bonding mechanism, develop and optimize bonding process with Cu wire.
Project supervisor(s)
- Professor Michael Mayer
- Professor Y. Norman Zhou
Research Interests
- Microjoining technology in microelectronic packaging and assembly
ultrasonic wire bonding.