Affiliations
Centre for Advanced Materials Joining
Department of Mechanical and Mechatronics Engineering
University of Waterloo
200 University Ave West
Waterloo, Ontario N2L 3G1
Canada
Contact Information
Phone: (519)-888-4567, ext. 38579
Office: E2-4403
Email: hjkim76@uwaterloo.ca
Biographical Information
2009 to present: Research Associate, Centre for Advanced Materials Joining, University of Waterloo
2008 to 2009: Research Associate, State University of New York at Binghamton, Binghamton, USA
2007 to 2008: Postdoctoral fellow, Institute of Applied Science, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea
2007: PhD, Department of Materials Science and Engineering, KAIST, Daejeon, Republic of Korea
2002: MSc, Department of Materials Science and Engineering, KAIST, Daejeon, Republic of Korea
2000: BSc, Department of Materials Science and Engineering, KAIST, Daejeon, Republic of Korea
Research Interests
- Flip chip (solder or non-solder)
- Assembly, characterization, and reliability assessment of COB, COG, and COF
- Interfacial reactions and reliability assessment
- Wafer-level packaging
- Process, characterization, and reliability assessment
- Epoxy & acrylate-based conductive adhesives
- Synthesis of ACF, ACP, and NCP
- Ultrasound aided fast adhesive bonding at low temperature (less than 100ºC)
- Wire bonding
- Interfacial reaction and reliability of Au wire/Al pad and Cu wire/Al pad system
- Electromigration & current carrying capability
- Nanomaterials fabrication for flexible electronics
- Growth and fabrication of solution-processed ZnO and TiO2 nanorods, nanoparticles
- Thin film transistor and photovoltaic cell fabrication and characterization
Selected Publications
- H. J. Kim, and K. W. Paik, “Adhesion and Reliability of Anisotropic Conductive Films (ACFs) on Organic Solderability Preservatives (OSPs)”, Journal of Electronic Materials, Vol. 37, No. 7, pp. 1003-1011 (2008)
- H. J. Kim, J. S. Cho, Y. J. Park, J. Lee, and K. W. Paik, “Effects of Pd Addition on Au Stud Bumps/Al Pads Interfacial Reactions and Bond Reliability”, Journal of Electronic Materials, Vol. 33, No. 10, pp. 1210-1218 (2004)
- H. J. Kim, C. K. Chung, Y. M. kwon, M. J. Yim, S. M. Hong, S. Y. Jang, Y. J. Moon, and K. W. Paik, “Study of the Formation of Bubbles in Rigid-Flexible Substrates Bonding using Anisotropic Conductive Films (ACFs) and the Bubbles Effects on ACF Joints Reliability”, Journal of Electronic Materials, Vol. 36, No. 1, pp. 56-64 (2007)
- K. W. Lee, H. J. Kim, M. J. Yim, and K. W. Paik, “Ultrasonic Bonding using Anisotropic Conductive Films (ACFs) for Flip Chip Interconnection”, IEEE Transaction on Electronics Packaging & Manufacturing, Vol. 32, No. 4, pp. 241-247 (2009)