Affiliations
Centre for Advanced Materials Joining
Department of Mechanical and Mechatronics Engineering
University of Waterloo
Laboratory for Microjoining
Contact Information
Phone: (519)-888-4567, ext. 4024
Fax: (519)-885-5862
Office: E2 2306
Email: mmayer@mecheng1.uwaterloo.ca
Department of Mechanical and Mechatronics Engineering
University of Waterloo
200 University Avenue West
Waterloo, Ontario N2L 3G1
Canada
Research Interests
Microjoining is the field of welding or joining of micro-scale components for microelectronics and other microdevices. Connections produced with microjoining processes are needed for the assembly, electrical contact, or hermetic encapsulation of devices. Our research focuses on finding detailed understanding of the mechanisms of such microjoining processes. Real-time monitoring of the physical conditions during microjoining and numerical modelling of microjoining processes are important steps towards a thorough understanding of microjoining. To further advance microjoining technologies, our research also addresses new developments in materials, equipment modules, parameter control software, and accurate positioning as well as technologies for cleaning and localized heating.
Selected Publications
- J. Schwizer, M. Mayer, and O. Brand, “Force Sensors for Microelectronic Packaging Applications”, Springer Science+Business Media, Series: Microtechnology and MEMS, ISBN: 3-540-22187-5, 2004
- M. Mayer, O. Paul, D. Bolliger, and H. Baltes, “Integrated Temperature Microsensors for Characterization and Optimization of Thermosonic Ball Bonding Process”, IEEE Trans. Comp. Packaging Technol., vol. 23, no. 2, pp. 393-398, 2000
- M. Mayer and J. Schwizer, “Thermosonic Ball Bonding Model based on Ultrasonic Friction Power”, Proc. Electronic Packaging Technology Conference EPTC’03 (IEEE), Singapore, pp. 738-743, 2003