Yanhong (Tina) Tian

Associate Professor

Contact Information

email: tianyh@hit.edu.cn
Microjoining Laboratory
Harbin Institute of Technology
Harbin, China 150001

Biographical Information

2004: Postdoctorate, Department of Mechanical Engineering, University of Waterloo, Canada
2003: PhD, Department of Materials Science and Engineering, Harbin Institute of Technology, China

Research Projects

Copper wire bonding mechanism and finite element analysis (FEA) on wire bonding process

This project is to improve the wire bonding reliability, study bonding mechanism, develop and optimize bonding process by using both experimental (SEM, TEM, ESCA, etc.) and numerical (eg. using FEA) analysis with Cu wire and/or Cu substrate/metallization.

Research Interests

  • Microjoining technology in microelectronic packaging and assembly
  • Laser soldering and lead-free soldering
  • Ultrasonic wire bonding
  • Finite element analysis by MARC.MSC, ANSYS and ABAQUS

Selected Publications

  • Tian, Y.H., Lum, I., Won, S.J., Park, S.H., Jung, J.P., Mayer, M., Zhou, Y., “Experimental study of ultrasonic wedge bonding with copper wire”, Proc. 6th Intl. Conf. Electronic Packaging Technology 2005, pp. 389-393, 2005
  • Yanhong Tian, Chunqing Wang, Xiushan Ge, Peter Liu, Deming Liu, “Intermetallic compounds formation at interface between PBGA solder ball and Au/Ni/Cu/BT PCB substrate after laser reflow processes”, Materials Science and Engineering: B 2002, 95(3): 254-262
  • Yanhong Tian, Chunqing Wang, Deming Liu, “Thermo-mechanical Behavior of PBGA Package during Laser and Hot Air Reflow Soldering”, Modeling and simulation in Materials Science and Engineering, 2004, 15(2): 235-243