Rapid Prototyping Lab

Laser Machine Protolaser U3 (The Swiss Army Knife from LPKF)

LPKF – ProtoLaser U3Protolaser U3 is an ultra-fast and advanced PCB laser etching machine. The ProtoLaser U3 can etch circuits, drill holes, and depanel PCBs all in a single step. The ProtoLaser U3 provides a chemical-free process with no mechanical stress. A variety of materials from flexible ones to silicon can be etched and structured using the Protolaser U3.

  • UV laser machine working at 355 nm.
  • No mask, no mechanical stress, limited thermal stress and minimized debris. 
  • Material diversity (PCBs, flexible materials, silicon, Alumina, etc.).
  • Maximum material size: 9” x 12”. 
  • Structuring, surface etching, depaneling, drilling, depth engraving, cutting, and skiving.
  • Accuracy: 2µ. 
  • Reputability: ±2 µm. 
  • PCB structuring specs for I Oz copper thickness: minimum trace spacing= 20 µm,
    minimum trace width= 50µ.

Milling Machine Protomat S103 (LPKF)

LPKF – Protomat S103The ProtoMat S103 provides precise, quick and simple in-house PCB prototyping, delivering PCBs in hours instead of days. Extensively equipped for multilayer and microwave and RF applications, the S103 is extremely fast and accurate, ensuring ultra-fine PCB prototyping. The system routes complex shapes and cut-outs, depanelizes populated PCBs, housing parts, or front panels, and processes substrates with delicate surfaces.

  • Milling/drilling single & double sided PCBs.
  • Highest available speed: 100000 rpm.
  • Resolution: 0.5 µm.
  • Reputability: ±µm. 
  • Pocketing mode. 
  • Precision of front-to-back alignment: 20 µm.
  • Max. material size: 9” x 12”. 
  • No mechanical stress.
  • Limited thermal stress.

Multilayer Press Multipress S (LPKF)

LPKF – Multilayer Press- Multipress SThe LPKF MultiPress S is a bench-top multilayer press, ideal for creating multilayer circuit boards in a laboratory or prototyping environment. With a shorter pressing time of approximately ninety minutes, the system offers faster turnaround times than ever before.

  • Maximum layout area: 8.2” x 11.2”.
  • Maximum pressure: 286 N/cm2.
  • Maximum number of layers: 8.

Through-hole Plating Contac RS (LPKF)

Through-hole Plating – Contac RS (LPKF)The LPKF Contac RS and MiniContac RS are through-hole plating systems specially developed for the professional production of prototype and small batch production printed circuit boards, featuring Reverse Pulse Plating and unmatched ease-of-use. The systems are ideal for any rapid PCB prototyping situation, especially small runs and tight work locations.

  • Reverse Pulse Plating (RPP) mode for having high quality plating.
  • Maximum PCB size: 13” x 18”.
  • Hole diameter: >200 µm. 
  • Ideal for through-hole plating multilayer PCBs. 
  • Number of through-plated holes: No limit.
  • Maximum number of layers: 8. 
  • Maximum contact resistance: 10 mΩ.
  • Chemical thinning: Yes. 
  • Activator: Carbon.

SMB Rapid Prototyping

  • ProtoPrintS (LPKF): Manual fine-pitch stencil printer for accurately positioning and dispensing solder paste onto PCBs.
  • LPKF ProtoFlow S: Reflow oven for lead-free soldering features a large material size and precisely controlled temperature profile.
  • LPKF ProtoPlace S: Pick&Place system for accurately positioning SMT components on PCBs – from small chips to large QFPs.

Die-bonder Fine Placer Lambda (Finetech)

Die-Bonder- Finplacer Lambda (Finetech)The flexible Fine placer Lamda is a sub-micron die-bonder for precision die attach and advanced chip packaging. It offers a modular design and can be easily reconfigured for future applications, making it the premier choice when maximum technological versatility and fast process implementation is key.

  • Placement accuracy: 0.5µm.
  • Component size: Minimum 0.1 x 0.1 mm and Maximum 15 by 15 mm.
  • Bonding force range: 0.1-400 N.
  • Heating Temp. (Max.): 400o C. 
  • Precise die bonding (face up), laser bar bonding, photo diode bonding, LED bonding, Micro optics assembly, MEMS packaging, Sensor packaging, Bump Bonding, 3D packaging, Chip on glass, chip on flex. 
  • Unique optical resolution.
  • Handles ultra small components with special tooling. 
  • Closed loop force control.
  • Virtually unlimited range of advanced bonding technologies. 
  • User independent die placement and process operation. 
  • Provides high level of reproducibility and application flexibility.
  • Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment, light and vision. 
  • Flip chip bonding (face down).

Programmable Wine Bonder HB16 (TPT)

Programmable Wire Bonder- HB16 (tpt)The HB16 is a bench top size wire bonder, ideal for small scale production line. One bond head for bonding a Ball/Wedge or Wedge/Wedge bonding mode.

  • Bonding method: Wedge-Wedge, Ball-Wedge, Ribbon-bonding, Bump bonding, Gold and aluminium wire.
  • Wire diameter: 17 – 70 µm.
  • Ribbon size: maximum 25×250 µm.
  • Electronic ball size control.