Yan Huang

MASc Student


Yan Huang
Centre for Advanced Materials Joining
Department of Mechanical and Mechatronics Engineering
University of Waterloo

Contact Information

Email: y9huang@engmail.uwaterloo.ca
Department of Mechanical and Mechatronics Engineering
University of Waterloo
200 University Avenue West
Waterloo, Ontario  N2L 3G1

Biographical Information

2007: BASc, Honours in Electrical Engineering Co-op, University of Waterloo

Research Projects

Finite Element Simulation of the Thermosonic Bonding Process

Thermosonic wire bonding is the process in which chip is connected to the substrate using very fine diameter wire. 90% of today’s interconnect are accounted by thermosonic wire bonding due to its fast and low cost properties. However, accurately controlling the impact and stead state force, and the ultrasonic energy of the thermosonic process remains a novel study today. The goal of the finite element simulation is to determine the most optimized process parameters, which after calibration with the experimental results, will allow more reliable and lower cost wire bonding system to be implemented in the industry.

Project sponsor(s)

  • Microbond
  • MKE

Project supervisor(s)

  • Professor Michael Mayer

Thesis Supervisor(s)

  • Professor Michael Mayer
  • Professor Norman Zhou

Additional Information/Other Interests

In my spare time, I enjoy playing a variety of sports, which include basketball, ping-pong, bowling, tennis and board games. I also like to collect special edition coins and paper bills from various countries. Most of all, I love to meet new people, because everyone has something special to learn from.