Zwart, A., Derige, G., Effa, D., Nieva, P., & Lancaster-Larocque, S. (2009). A Novel Virtual Button User Interface for Determining the Characteristics of an Impulse Input Based on MEMS Inertial Sensors Sensors & Transducers, 7, 179.
Reference author: P Nieva
First name
P
Last name
Nieva
Bassiachvili, E., Nieva, P., & Khajepour, A. (2009). On-Chip Young s Modulus Characterization of the Effect of Phosphorus Heavy Doping on Polysilicon Thin Films ASME International Mechanical Engineering Congress and Exposition, 43857, 77-83.
Nieva, P., McGruer, N., & Adams, G. (2006). A multipurpose optical MEMS sensor for harsh environments 2006 NSTI Nanotechnology Conference and Trade Show-NSTI Nanotech 2006 Technical Proceedings, 3, 419-422.
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Tada, H., Nieva, P., Zavracky, P., Miaoulis, I., & Wong, P. (1998). Determining the high-temperature properties of thin films using bilayered cantilevers MRS Online Proceedings Library (OPL), 546.
Tada, H., Abramson, A., Nieva, P., Zavracky, P., Miaoulis, I., & Wong, P. (1998). MEMS as Temperature Sensors During High Temperature Processing MRS Online Proceedings Library Archive, 518.
Abramson, A., Tadal, H., Nieva, P., Zavracky, P., Miaoulis, I., & Wong, P. (1998). Partial Transparency Effects of Silicon During Rapid Thermal Processing MRS Online Proceedings Library (OPL), 525.
Bassiachvili, E., , Nieva, P., & Khajepour, A. (2010). On-Chip Structures for the Determination of the Dopant-Dependent Young s Modulus of Heavily Phosphorus Doped Polysilicon With Stress Compensation ASME International Mechanical Engineering Congress and Exposition, 44472, 45-50.
Effa, D., Nieva, P., Andrew, Z., & Lancaster, S. (2009). Design and modeling of a MEMS accelerometer for a novel Virtual Button user interface 2009 IEEE Toronto International Conference Science and Technology for Humanity (TIC-STH), 597-602. IEEE.
Shavezipur, M., Nieva, P., Khajepour, A., & Hashemi, S. (2009). Development of parallel-plate-based MEMS tunable capacitors with linearized capacitance-voltage response and extended tuning range Journal of Micromechanics and Microengineering, 20, 025009.
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