519-888-4024 or x84024
Location: 
E5 3009
Research Expertise
  • Electronic packaging
  • Microfabrication
  • Microjoining processes
  • Sensor technology
  • Thermosonic and ultrasonic wire bonding
  • Ultrasonic Finite Element Models

Centre for Advanced Materials Joining

Group(s): 
Lightweighting and Fabrication→Joining; I to M profiles