Negus, K., & Yovanovich, M. (1989). Transient Temperature Rise at Surface Due to Arbitrary Contacts on Half-Spaces In Transactions of the CSME (Vol. 13, pp. 1-9). N/A.
References
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Turyk, P. J., & Yovanovich, M. (1989). Modeling of Effective Heat Transfer Properties in Basic Cells of Binary-Component Packed Beds In ASME Winter Annual Meeting (pp. 89-99). San Fransisco, CA: N/A.
Lee, S., & Yovanovich, M. (1989). Natural Convection From a Vertical Plate with Step Changes in Surface Heat Flux In ASME National Heat Transfer Conference (Vol. 107, pp. 239-247). Philadelphia, PA: The American Society of Mechanical Engineering.
Negus, K., Yovanovich, M., & Beck, J. (1989). On the Non-Dimensionalization of Constriction Resistance for Semi-Infinite Heat Flux Tubes In Journal of Heat Transfer - Technical Notes (Vol. 11, pp. 804-807). Technical Notes.
Lee, S., & Yovanovich, M. (1989). Conjugate Heat Transfer From a Vertical Plate With Discrete Heat Sources Under Natural Convection In ASME Journal of Electronic Packaging (Vol. 111, pp. 261-267). ASME .
Fisher, N., & Yovanovich, M. (1989). Thermal Constriction Resistance of Sphere/Layered Flat Contacts: Theory and Experiment In ASME Journal of Heat Transfer (Vol. 111, pp. 249-256). ASME.
Song, S., & Yovanovich, M. (1989). Contact Interface Gas Heat Transfer: A Method of Measuring Thermal Accommodation Coefficient In 9th Annual International Electronics Packaging Conference (Vol. 2, pp. 925-936). N/A.
Negus, K., Franklin, R., & Yovanovich, M. (1989). Thermal Modeling and Experimental Techniques for Microwave Bipolar Devices In IEEE Transactions on Components Hybrids and Manufacturing Technology (Vol. 12, pp. 63-72). N/A.
Choy, C. L., & Yovanovich, M. (1989). Microcomputer Computation of Natural Convection Heat Transfer from Isothermal Spheres into Air for Rayleigh Numbers from 1.5 to 10^7 In Numerical Heat Transfer with Personal Computers and Supercomputing (Vol. 110, pp. 87-93). Philadelphia, PA: ASME National Heat Transfer Conference.
Antonetti, V., & Yovanovich, M. (1988). Using Metallic Coatings to Enhance Thermal Contact Conductance of Electronic Packages In Journal of Heat Transfer Engineering (Vol. 9, pp. 85-92). N/A.