Effects of dry plasma releasing process parameters and induced in-plane stress on MEMS devices yield
| Title | Effects of dry plasma releasing process parameters and induced in-plane stress on MEMS devices yield |
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| Author | |
| Year of Publication |
2012
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| Conference Name |
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices XI
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| Publisher |
International Society for Optics and Photonics
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| Download citation |