Effects of dry plasma releasing process parameters and induced in-plane stress on MEMS devices yield
Title | Effects of dry plasma releasing process parameters and induced in-plane stress on MEMS devices yield |
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Author | |
Year of Publication |
2012
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Conference Name |
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices XI
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Publisher |
International Society for Optics and Photonics
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