Reference author: Peter Wong

First name

Peter

Middle name

Y

Last name

Wong

Tada, H., Kumpel, A. E., Lathrop, R. E., Slanina, J. B., Nieva, P., Zavracky, P., … Wong, P. Y. (2000). Novel imaging system for measuring microscale curvatures at high temperatures Review of Scientific Instruments, 71, 161-167.

Tada, H., Kumpel, A. E., Lathrop, R. E., Slanina, J. B., Nieva, P., Zavracky, P., … Wong, P. Y. (2000). STRUCTURAL, MECHANICAL, THERMODYNAMIC, AND OPTICAL PROPERTIES OF CONDENSED MATTER (PACS 61-68, 78)-Thermal expansion coefficient of polycrystalline silicon and silicon dioxide thin films at high Journal of Applied Physics, 87, 4189-4193.

Tada, H., Kumpel, A. E., Lathrop, R. E., Slanina, J. B., Nieva, P., Zavracky, P., … Wong, P. Y. (2000). Thermal expansion coefficient of polycrystalline silicon and silicon dioxide thin films at high temperatures Journal of Applied Physics, 87, 4189-4193.

Bargmann, M., Kumpel, A., Tada, H., Nieva, P., Zavracky, P., Miaoulis, I. N., & Wong, P. Y. (1999). Temperature-dependent coefficient of thermal expansion of silicon nitride films used in microelectromechanical systems MRS Online Proceedings Library, 605, 235-240.

Tada, H., Abramson, A. R., Miaoulis, I. N., Wong, P. Y., Nieva, P., & Zavracky, P. (1998). Effects of surface patterning in thin film structures on the thermal radiative properties during rapid thermal processing ASME HEAT TRANSFER DIV PUBL HTD, 361, 93-98.