Vendor: Süss MicroTec
Model: MA6/BA6 mask/bond aligner/exposure system equipped with bottom-side alignment option
Purpose: Alignment and UV exposure of resist-coated wafers using photomasks in MA6 mode, alignment before bonding in BA6 mode
Equipment description:
The MA6/BA6 aligner features a bright UV light source with two filter options for exposing a variety of photoresists quickly and easily. The tool accommodates multiple mask sizes and sample dimensions. Cameras on the top and bottom side of the sample allow for front and backside alignment between the mask and substrate with an accuracy of 1 μm.
System features and option:
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350 W broadband (250 nm to 400 nm) lightsoure
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Lightsource can be filtered with g-line filter or UV400 filter
- Enhanced image storage system (EISS) for precise alignment
- Front/back side alignment via split-field microscope coupled to two high resolution charge-couple device (CCD) cameras
- Wedge error correction (WEC) to ensure substrate and mask surfaces are parallel to each other
- Multiple sample chucks for UV exposure: pieces, 2″, 3″, 4″ or 6″ wafers
- Multiple sample contact modes: proximity, soft contact, hard contact, vacuum contact
- Multiple mask holders for holding: 3.5″, 5″, 6″ or 7″ masks
- Bond adapter and 3″ and 100 mm wafer bond chucks for pre-bond alignement
