The
QNC
packaging
lab
is
situated
on
the
main
floor
of
the
Mike
and
Ophelia
Lazaridis
Quantum-Nano
Centre,
attached
to
the
QNC
cleanroom.
This
is
a
300
sq.
ft.
lab
space
housing
semiconductor
packaging
equipment
such
as
wire
bonders,
a
flip
chip
bonder
and
a
wafer
dicing
saw.
