The QNC packaging lab is situated on the main floor of the Mike and Ophelia Lazaridis Quantum-Nano Centre, attached to the QNC cleanroom. This is a 300 sq. ft. lab space housing semiconductor packaging equipment such as wire bonders, a flip chip bonder and a wafer dicing saw.
The QNC packaging lab is situated on the main floor of the Mike and Ophelia Lazaridis Quantum-Nano Centre, attached to the QNC cleanroom. This is a 300 sq. ft. lab space housing semiconductor packaging equipment such as wire bonders, a flip chip bonder and a wafer dicing saw.
