Purpose: Dicing of thin substrates into smaller pieces
The Disco DAD3240 is a small footprint 200 mm compatible automatic dicing saw. This tool is used to cut semiconductor wafers into individual chips or dies. It is typically configured to accept samples that are mounted on dicing frames, enabling flexible handling of small pieces up to 150 mm wafers without modification to the DAD3240's chuck.
System features and options:
- Documented processes for dicing:
- Quartz / glass
- Lithium niobate