Vendor:
Tresky
Model:
T-3000-FC3
die
bonder
Purpose:
Bonding
of
semiconductor
dies
to
packages
or other
dies
Equipment description:
The Tresky T-3000-FC3 die bonder enables bonding of semiconductor dies to packages through standard thermosonic bonding methods.
The T-3000-FC3 is also capable of performing more complex “flip chip” type die bonding.
A bonding force of up to 490 N (50 kg mass) may be applied at temperatures up to 400°C. An ultrasonic transducer may also be employed for the purposes of bonding (100 W at a static force of up to 340 N).
System features and options:
-
Flip-chip assembly is equipped with a camera and a monitor. Flip-chip prism with an inbuilt mirror is capable of viewing two opposed pictures at the same time on the monitor.
-
Conventional microscope for viewing placements and alignments.
-
Quick heat stage has rapid heat up and is cooled using air jets. Quick heat stage is controlled through software with real time temperature viewing.
-
Programmable Z-drive with bond force control.
