Model: T-3000-FC3 die bonder
Purpose: Bonding of semiconductor dies to packages or other dies
The Tresky T-3000-FC3 die bonder enables bonding of semiconductor dies to packages through standard thermosonic bonding methods.
The T-3000-FC3 is also capable of performing more complex “flip chip” type die bonding.
A bonding force of up to 490 N (50 kg mass) may be applied at temperatures up to 400°C. An ultrasonic transducer may also be employed for the purposes of bonding (100 W at a static force of up to 340 N).
System features and options:
Flip-chip assembly is equipped with a camera and a monitor. Flip-chip prism with an inbuilt mirror is capable of viewing two opposed pictures at the same time on the monitor.
Conventional microscope for viewing placements and alignments.
Quick heat stage has rapid heat up and is cooled using air jets. Quick heat stage is controlled through software with real time temperature viewing.
Programmable Z-drive with bond force control.