Vendor: SÜSS MicroTec
Model: SB6 GEN2 wafer bonder with 550℃ heating option
Purpose: Permanent bonding of two blank or patterned substrates
Equipment description:
The SB6 is a semi-automated wafer bonder capable of executing a variety of different wafer bonding processes. The SB6 system may be used with the SÜSS BA6 aligner to enable alignment of substrates prior to the bonding process. System is equipped with bonding fixtures enabling bonding of 100 mm wafers, 3″ wafers and smaller substrates.
System features and options:
-
20 kN maximum tool force
-
Turbopumped process chamber (achievable pressure < 5x10-5 mbar)
- 150 mm bond head with maximum temperature of 550℃
- Closed fixture
- Anodic bonding power supply up to 2000 V
-
Compatible
bonding
process
types:
- Adhesive
- Anodic (3″ and 100 mm wafers only)
- Eutectic
- Fusion
- Glass frit
-
Compatible
substrate
tooling
(bonder):
- 100 mm wafers
- 3″ wafers and small pieces
-
Bond
chucks
available
for
pre-bond
alignment
on
SÜSS
BA6
aligner:
- 100 mm wafers
- 3″ wafers and small pieces
