Vendor: TOHO Technology
Model: FLX-2320-R
Purpose: Measuring thin film stress
Equipment description:
The Toho FLX-2320-R is used to determine the stress state of a thin film on a wafer. The Toho uses a laser-photodiode setup is used to determine the height profile (or bowing) of a wafer. Using bowing measurements taken before film deposition and after film deposition the Toho uses a modified Stoney’s equation to determine the stress of the film.
System features:
- 3”, 4” and 6” wafer handling
- Dual selectable laser wavelengths
- Automated rotation for accurate stress mapping
- 3D visualization
