Vendor: TOHO Technology

Model: FLX-2320-R

Purpose: Measuring thin film stress

Equipment wiki link

Equipment description:

The Toho FLX-2320-R is used to determine the stress state of a thin film on a wafer. The Toho uses a laser-photodiode setup is used to determine the height profile (or bowing) of a wafer. Using bowing measurements taken before film deposition and after film deposition the Toho uses a modified Stoney’s equation to determine the stress of the film.

System features:

  • 3”, 4” and 6” wafer handling
  • Dual selectable laser wavelengths
  • Automated rotation for accurate stress mapping
  • 3D visualization