Vendor: West-Bond Inc.
Model: 7476E
Purpose: Used for making electrical contacts between semiconductor dies and packages
Equipment description:
The Westbond 7476E wirebonder is a manual wirebonding tool designed to make electrical interconnects between integrated circuit packages and integrated circuit dies. This tool is capable of doing standard 45° wedge bonding and 90° wedge bonding (deep access). The tool is optimized for Au or Al wires with a 25 μm (0.001”) diameter. Other wires or dimensions may or may not be suitable, please consult with fab staff on these matters.
System features and options:
- 45° wedge and 90° (deep access) wedge configurations
- Compatible with Al and Au wires from 0.7 mil to 2 mil in diameter for room temperature thermosonic bonding
- 4 W 63 kHz ultrasonic transducer
- Manual control available via 8:1 reduction ratio micromanipulator arm
West-Bond 7476E manual wirebonder
