Vendor: Angstrom Engineering Inc.
Model: Nexdep system with glovebox
Purpose: Physical vapour deposition of thin films via thermal evaporation
Equipment description:
The Angstrom Engineering thermal evaporator is capable of evaporating a limited number of materials using thermal evaporation. The primary purpose of this system is for depositing thin metal contacts on 2D material devices. The system is installed in a nitrogen glovebox to enable work on air sensitive samples. For a comprehensive list of available processes and disallowed processes, please consult the equipment wiki page.
System features and options:
- Four thermal evaporation sources (via resistive heating)
- Pumping by 400 L/s turbopump
- Substrate size compatibility from small pieces to 100 mm wafers
- Base pressure of < 1x10-6 Torr
- Processes Available: Au, Ti, Pd, others by request
