Vendor: Polos
Model: Beam
Purpose: Maskless UV lithography
Equipment description:
The Polos Beam is a desktop maskless lithography system able to expose patterns in photosensitive resists with feature sizes of 0.8 µm or greater. Maskless lithography allows for faster prototyping compared to mask-based fabrication. The stage can hold substrates up to 5” wafers with a maximum writing area of 106 x 106 mm. Patterns can be written at up to 15 mm2/min and can be aligned to existing features.
Equipment wiki link
System features and options:
- 365 nm exposure wavelength
- 20x objective enabling 0.8 µm linewidth
- 15 mm2/min exposure speed
- 400 µm maximum writefield
- 0.1 µm stage repeatability
- 106 x 106 mm stage travel
