Thursday, May 8, 2014 — 11:00 AM EDT

Speaker

Dr. Piero Triverio
Assistant Professor
Canada Research Chair in Modeling of Electrical Interconnects
The Edward S. Rogers Sr. Department of Electrical and Computer Engineering
University of Toronto

Topic

MoM-SO: an Efficient Surface Method for Computing the Series Impedance of Power and Microelectronic Cables

Abstract

Broadband cable models are of paramount importance for the design of both power grids and electronic products. They are required to predict electromagnetic transients that faults, lightning, and breakers operation may induce in power grids. In electronic design, cable models are needed to minimize electromagnetic compatibility issues in high-speed cables (e.g. USB, HDMI assemblies). Unfortunately, conventional modeling techniques like finite elements can be very time consuming for this task. In this talk, we present a fast technique for the broadband computation of cable impedance based on the method of moments and surface operators. Novel surface operators will be introduced to model coaxial sheaths, cables buried in lossy ground, and tunnels. Numerical examples, drawn from both power and electronic applications, will show that the proposed method accurately predicts skin, proximity, and ground return effects. Speed-ups beyond 1,000X with respect to finite elements will be demonstrated.

Speaker's biography

Piero Triverio received the M.Sc. and Ph.D. degrees in Electronic Engineering from Politecnico di Torino, Italy in 2005 and 2009, respectively. He is an Assistant Professor with the Department of Electrical and Computer Engineering at the University of Toronto, where he holds the Canada Research Chair in Modeling of Electrical Interconnects. His research interests include signal integrity, electromagnetic compatibility, and model order reduction. He received several international awards, including the 2007 Best Paper Award of the IEEE Transactions on Advanced Packaging, the EuMIC Young Engineer Prize at the 13th European Microwave Week, and the Best Paper Award at the IEEE 17th Topical Meeting on Electrical Performance of Electronic Packaging.

Location 
E5 building
Room 5106-5128

,

S M T W T F S
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
1
2
3
4
5
  1. 2019 (217)
    1. December (1)
    2. November (1)
    3. October (4)
    4. September (21)
    5. August (26)
    6. July (40)
    7. June (24)
    8. May (23)
    9. April (35)
    10. March (25)
    11. February (9)
    12. January (10)
  2. 2018 (150)
    1. December (13)
    2. November (25)
    3. October (12)
    4. September (13)
    5. August (7)
    6. July (23)
    7. June (9)
    8. May (6)
    9. April (9)
    10. March (16)
    11. February (10)
    12. January (7)
  3. 2017 (212)
  4. 2016 (242)
  5. 2015 (242)
  6. 2014 (268)
  7. 2013 (192)
  8. 2012 (31)