- Capable of wedge bonding, deep-access wedge bonding, and ball bonding
- Can use ribbon or wire ranging from 0.0007” to 0.002” (thickness or diameter)
- Range of tool movement: 0.5625” vertically and 0.6250” horizontally
- Adjustable ultrasonic bond energy
- Electric torch (flame-off)
- Height adjustable work platform
- Tool heat to approximately 250 °C (for wedge bonding) and 200 °C (for ball bonding)
- 2.25” x 3.00” work holder that can heat up to 400 °C
- Nikon SMZ660 microscope with 15x eyepieces
- Fluorescent illuminator
- System is electrostatic discharge (ESD) safe