Trion Phantom Reactive Ion Etcher (RIE)

  • Trion Phantom Reactive Ion Etcher
    Reactor chamber lid automatically opens and closes
  • Turbo pump backed by mechanical pump
  • System is liquid cooled using an external chiller
  • User manually loads wafers
  • 8” diameter wafer chuck
  • RF power: 600 watts (maximum)
  • Inductively coupled plasma (ICP) power: 1000 watts (max)
  • Fully automated processing from pump-down to deposition
  • Single gas manifold
  • Gases available for processes:
    • CF4, SF6, O2, CHF3, He/O2 Mix