High resolution printing down to 0.5µm Fast and accurate alignment with SUSS Splitfield Microscope High Resolution Optics optmized for thick resists Manual operation Vacuum, Hard, or Soft Contact, and Gap Exposure Up to 100 mm wafers
High resolution printing down to 0.5µm Fast and accurate alignment with SUSS Splitfield Microscope High Resolution Optics optmized for thick resists Manual operation Vacuum, Hard, or Soft Contact, and Gap Exposure Up to 100 mm wafers