- Allows the user to simultaneously view the underside of the die and the topside of the substrate to which the die will be attached to
- Two-colour charge-coupled device (CCD) cameras allow the die image and the substrate image to be superimposed on a monitor; this allows for fine alignment of die and substrate prior to attachment
- Variable directional lighting of both die and substrate allows features to be illuminated during alignment
- Uses a combination of work surface heat, tool heat, force, and ultrasonic energy to attach the die to the substrate
- Uses an attached vacuum system for the pick and place functionality
- Bond force, bond delay, and ultrasonic energy applied during bond are all user-adjustable
- Work surface and tool temperature up to 400 °C