Highly configurable inductively coupled plasma (ICP) Etching Systems. The PlasmaPro 100 Cobra tool is ideal for processing silicon and silicon dioxide etching, from Bosch high-rate recipes capable of through-wafer etching to unswitched pseudo-Bosch recipes suitable for etching thin SOI device layers for Si photonics applications. Also, it can be used for applications such as MEMS and CMOS technology.
Chemistry: C4F8, SF6, CF4, CHF3, Ar, O2
Wafer Handling: 100 mm, 150 mm
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