Oxford PlasmaPro 100 ICP DRIE for Si and Oxides

Oxford DRIE

Highly configurable inductively coupled plasma (ICP) Etching Systems. The PlasmaPro 100 Cobra tool is ideal for processing silicon and silicon dioxide etching, from Bosch high-rate recipes capable of through-wafer etching to unswitched pseudo-Bosch recipes suitable for etching thin SOI device layers for Si photonics applications. Also, it can be used for applications such as  MEMS and CMOS technology. 

Chemistry:  C4F8, SF6, CF4, CHF3, Ar, O2

Wafer Handling: 100 mm, 150 mm

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