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The Giga-to-Nanoelectronics Centre has reopened for research activities, as of August 17 2020.  Researchers wishing to use the facilities are required to review the new and additional safety material listed in the link at the left side of this page.

DISCO DAD-2H/6 dicing saw

DISCO DAD-2H/6 dicing sawDicing saw is used to dice or groove semiconductor wafers by employing a high-speed spindle fitted with an extremely thin diamond blade. Our DISCO DAD-2H/6 system can cut wafers of up to 6 inches in diameter.

Operator can load up to 10 types of programs by specifying the program number after such data as the X stroke, X speed, Y index, Z index, and theta index have been entered, and any program stored can be used at any time.

The machine can be controlled under manual, semi-auto, and full-auto operation modes, and four fixed modes (A, B, C, and D) of cutting are provided.

Detailed specifications are as follows.

  1. Wafer size: 2" to 6"
  2. X-axis:
    • Max table stroke: 160 mm
    • Cutting range: 1" to 6" in 1/2" increments
    • Cutting feed speed: 0.3 to 30 mm/sec
  3. Y-axis:
    • Max spindle stroke: 160 mm
    • Spindle index range: 0.0001" to 4" in 0.0001" increments
    • Indexing speed of spindle: 30 mm/sec
  4. Z-axis:
    • Range of depth left uncut: 0.005 to 19.995 mm in 0.005 increments
    • Cutting feed speed: 15 mm/sec
    • Return clearance of spindle: 0.7 mm
    • Cutting mode (FIX): A, B, C, and D
  5. Theta-axis:
    • Rotation range: 0 to 90 degree in 1 degree increments
  6. x120 mag alignment microscope with 5" monitor TV

Find out what we charge to use the dicing saw.

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