The Giga-to-Nanoelectronics (G2N) Centre has wafer dicing and wire bonding capabilities. DISCO DAD-2H/6 dicing saw Kulicke and soffa model 4123 universal wire bonder Return to lab equipment
The Giga-to-Nanoelectronics (G2N) Centre has wafer dicing and wire bonding capabilities. DISCO DAD-2H/6 dicing saw Kulicke and soffa model 4123 universal wire bonder Return to lab equipment