The Kulicke and soffa wire bonder uses heat and ultrasonic (‘thermosonic’) energy to stitch connecting wires between suitable bond points on semiconductor circuits or between bond points and external contacts such as package leads.
Features:
- 95 mm x 95 mm access for bonding area.
- capable of bonding Au wire (12.7-76.2 microns)
- capable of bonding Al wire (25.4-101.6 microns)