COVID-19 updates:

University of Waterloo Coronavirus Information website

See list of Faculty of Engineering Modified Services

The Giga-to-Nanoelectronics Centre has reopened for research activities, as of August 17 2020.  Researchers wishing to use the facilities are required to review the new and additional safety material listed in the link at the left side of this page.

Lab equipment

    Characterization equipment

    The Giga-to-Nanoelectronics (G2N) Centre has a wide variety of thin film devicelab user sitting at optical microscope

    and circuit characterization tools.


    Deposition equipment

    operator using PECVD cluster toolThe G2N Centre has the deposition capabilities for a variety of semiconductor, dielectric and conductive thin films: amorphous, nanocrystalline and poly-Si, SiOx, SiNx, SiOxNy, SiC, SiCN, ITO, ZnO, Al, Cr, Mo, W, Ta, organic materials (both small molecule and polymers). The maximum substrate size varies form 3 to 12 inches depending on the system.


    trion reactive ion etch systemThe G2N Centre has both wet etching and dry etching (F-based, O-based, and Cl-based dry etching (RF,ICP)) capabilities.

    Lithography equipment

    MA6 mask alignerThe G2N Centre has the ultraviolet (UV) contact lithography capabilities with resolution about 1 micrometer.

    Packaging and bonding equipment

    disco dicing sawThe G2N Centre has wafer dicing and wire bonding capabilities.