The SUSS MJB 3 mask aligner is designed for high-resolution photolithography in a laboratory or pilot production environment. It can produce line/space photoresist images down to 0.6 um with alignment accuracy down to 1 um under optimum conditions.
It is capable of processing silicon, glass, or other standard wafers up to 3” diameter (round). This system is equipped with SUSS diffraction to reduce exposure optics. A 350W mercury short-arc lamp is used, providing a broadband of exposure wavelengths of 350-450nm.
It can perform exposures in vacuum contact, hard contact, soft contact, or proximity mode.
Find out what we charge to use the Karl Suss MJB3 mask aligner.