Lab equipment

Characterization equipment

The Giga-to-Nanoelectronics (G2N) Centre has a wide variety of thin film device and circuit characterization tools.

List of characterization equipment

• Dektak 8 stylus profilometer
• Bruker D8 Discover X-ray Diffraction Spectrometer
• Hitachi SU5000 FESEM
• Keithley 4200-SCS semiconductor characterization system
• FT-IR 8400S spectrometer
• UV-2501PC spectrometer
• Raman spectrometer
• Reichert polylite 88 microscope
• Stressgauge

Deposition equipment

The G2N Centre has the deposition capabilities for a variety of semiconductor, dielectric and conductive thin films: amorphous, nanocrystalline and poly-Si, SiOx, SiNx, SiOxNy, SiC, SiCN, ITO, ZnO, Al, Cr, Mo, W, Ta, organic materials (both small molecule and polymers). The maximum substrate size varies form 3 to 12 inches depending on the system.

Deposition equipment

• Angstrom evovac vacuum deposition system
• AJA sputtering tool
• Ceradrop printer
• Edwards sputtering system
• Intlvac thermal/E-beam evaporator
• Selenium evaporator
• Parylene Coater
• WLOS cluster sputtering system
• WLO1 and WLO2 deposition systems

Etching

The G2N Centre has both wet etching and dry etching (F-based, O-based, and Cl-based dry etching (RF,ICP)) capabilities.

List of etching equipment

• Wet processing station
• Phantom II RIE

Lithography equipment

The G2N Centre has the ultraviolet (UV) contact lithography capabilities with resolution about 1 micrometer.

List of lithography equipment

• Mask aligner MA6
• Mask aligner MJB3

Packaging and bonding equipment

The G2N Centre has wafer dicing and wire bonding capabilities.

List of packaging and bonding equipment

• DISCO DAD-2H/6 dicing saw
• Kulicke and soffa model 4123 universal wire bonder