The SUSS MA6 mask aligner is regarded as the benchmark from semiconductor submicron research to 3D micro-system production.
The system is available with bottom-side-alignment microscopes for accurate backside processes, which is an important feature, especially in microsystem technology. For all classic lithography and topside alignment a dual video microscope is available. The maximum wafer size exposed is 6" square.
Find out what we charge to use the Karl Suss MA6 mask aligner.